Cita APA (7th ed.)
Liu, S., & Liu, Y. Modeling and Simulation for Microelectronic Packaging Assembly. John Wiley & Sons, Incorporated.
Cita Chicago (17th ed.)
Liu, Shen, i Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly. SG: John Wiley & Sons, Incorporated.
Cita MLA (9th ed.)
Liu, Shen, i Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly. John Wiley & Sons, Incorporated.
Atenció: Aquestes cites poden no estar 100% correctes.