Cita APA (7a ed.)
Azman, M. A., Abdullah, M., Loh, W. K., & Ooi, C. K. (2025). Advancing packaging technology: Computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages. Soldering & Surface Mount Technology. https://doi.org/10.1108/SSMT-05-2024-0022
Cita Chicago Style (17a ed.)
Azman, Muhammad Aqil, Mz Abdullah, Wei Keat Loh, y Chun Keang Ooi. "Advancing Packaging Technology: Computational Fluid Dynamics Modeling for Capillary Underfill Encapsulant in Multi-chip Heterogenous Packages." Soldering & Surface Mount Technology 2025. https://doi.org/10.1108/SSMT-05-2024-0022.
Cita MLA (9a ed.)
Azman, Muhammad Aqil, et al. "Advancing Packaging Technology: Computational Fluid Dynamics Modeling for Capillary Underfill Encapsulant in Multi-chip Heterogenous Packages." Soldering & Surface Mount Technology, 2025, https://doi.org/10.1108/SSMT-05-2024-0022.
Precaución: Estas citas no son 100% exactas.