APA-viite (7. p.)
Ching-Feng, Y., Jr-Wei, P., Chih-Cheng, H., Chin-Hung, W., & Wei-Chung, L. (2025). Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging. Micromachines. https://doi.org/10.3390/mi16030342
Chicago-viite (17. p.)
Ching-Feng, Yu, Peng Jr-Wei, Hsiao Chih-Cheng, Wang Chin-Hung, ja Lo Wei-Chung. "Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging." Micromachines 2025. https://doi.org/10.3390/mi16030342.
MLA-viite (9. p.)
Ching-Feng, Yu, et al. "Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging." Micromachines, 2025, https://doi.org/10.3390/mi16030342.
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