Cai, W., Yang, Y., Fang, Z., Chu, Z., & Li, H. (Sep 2025). Springback simulation of non-isothermal electrical-assisted hot stamping for ultra-thin titanium bipolar plate. Journal of Physics: Conference Series. https://doi.org/10.1088/1742-6596/3104/1/012087
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Cita Chicago Style (17a ed.)
Cai, Wentao, Yanfeng Yang, Zhen Fang, Zhenguan Chu, y Heng Li. "Springback Simulation of Non-isothermal Electrical-assisted Hot Stamping for Ultra-thin Titanium Bipolar Plate."
Journal of Physics: Conference Series Sep 2025. https://doi.org/10.1088/1742-6596/3104/1/012087.
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Cita MLA (9a ed.)
Cai, Wentao, et al. "Springback Simulation of Non-isothermal Electrical-assisted Hot Stamping for Ultra-thin Titanium Bipolar Plate."
Journal of Physics: Conference Series, Sep 2025, https://doi.org/10.1088/1742-6596/3104/1/012087.
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