Cita APA (7a ed.)
Wu, H., Fang, Y., Chen, Y., Lu, J., Lu, M., Chang, S., & Keng, P. Y. (2025). Molecularly tailored SAMs for Ru interconnects: High-temperature stability, suppressed metal diffusion, and enhanced adhesion. NPG Asia Materials. https://doi.org/10.1038/s41427-025-00627-2
Cita Chicago Style (17a ed.)
Wu, Hong-Yi, Yi-Ying Fang, Yu-Lin Chen, Jung-Fu Lu, Ming-Yen Lu, Shou-Yi Chang, y Pei Yuin Keng. "Molecularly Tailored SAMs for Ru Interconnects: High-temperature Stability, Suppressed Metal Diffusion, and Enhanced Adhesion." NPG Asia Materials 2025. https://doi.org/10.1038/s41427-025-00627-2.
Cita MLA (9a ed.)
Wu, Hong-Yi, et al. "Molecularly Tailored SAMs for Ru Interconnects: High-temperature Stability, Suppressed Metal Diffusion, and Enhanced Adhesion." NPG Asia Materials, 2025, https://doi.org/10.1038/s41427-025-00627-2.
Precaución: Estas citas no son 100% exactas.