Surface-Based Authentication System for Integrated Circuit Chips

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Gepubliceerd in:arXiv.org (Dec 19, 2024), p. n/a
Hoofdauteur: Liu, Runze
Andere auteurs: Datta, Prasun, Nakra, Anirudh, Chau-Wai Wong, Wu, Min
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Cornell University Library, arXiv.org
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022 |a 2331-8422 
035 |a 3147567902 
045 0 |b d20241219 
100 1 |a Liu, Runze 
245 1 |a Surface-Based Authentication System for Integrated Circuit Chips 
260 |b Cornell University Library, arXiv.org  |c Dec 19, 2024 
513 |a Working Paper 
520 3 |a The rapid development of the semiconductor industry and the ubiquity of electronic devices have led to a significant increase in the counterfeiting of integrated circuits (ICs). This poses a major threat to public health, the banking industry, and military defense sectors that are heavily reliant on electronic systems. The electronic physically unclonable functions (PUFs) are widely used to authenticate IC chips at the unit level. However, electronic PUFs are limited by their requirement for IC chips to be in working status for measurements and their sensitivity to environmental variations. This paper proposes using optical PUFs for IC chip authentication by leveraging the unique microscopic structures of the packaging surface of individual IC chips. The proposed method relies on color images of IC chip surfaces acquired using a flatbed scanner or mobile camera. Our initial study reveals that these consumer-grade imaging devices can capture meaningful physical features from IC chip surfaces. We then propose an efficient, lightweight verification scheme leveraging specular-reflection-based features extracted from videos, achieving an equal error rate (EER) of 0.0008. We conducted factor, sensitivity, and ablation studies to understand the detailed characteristics of the proposed lightweight verification scheme. This work is the first to apply the optical PUF principle for the authentication of IC chips and has the potential to significantly enhance the security of the semiconductor supply chain. 
653 |a Optical scanners 
653 |a Feature extraction 
653 |a Electronic systems 
653 |a Verification 
653 |a Integrated circuits 
653 |a Semiconductors 
653 |a Color imagery 
653 |a Public health 
653 |a Specular reflection 
653 |a Ablation 
653 |a Defense industry 
653 |a Image acquisition 
653 |a Error analysis 
653 |a Weight reduction 
653 |a Industrial development 
653 |a Authentication 
653 |a Lightweight 
653 |a Supply chains 
653 |a Electronic packaging 
700 1 |a Datta, Prasun 
700 1 |a Nakra, Anirudh 
700 1 |a Chau-Wai Wong 
700 1 |a Wu, Min 
773 0 |t arXiv.org  |g (Dec 19, 2024), p. n/a 
786 0 |d ProQuest  |t Engineering Database 
856 4 1 |3 Citation/Abstract  |u https://www.proquest.com/docview/3147567902/abstract/embedded/75I98GEZK8WCJMPQ?source=fedsrch 
856 4 0 |3 Full text outside of ProQuest  |u http://arxiv.org/abs/2412.15186