Cita APA (7a ed.)
Shih, H., Lee, Y., Pan, J., & Chung, C. (2025). Effects of Sn addition in W-doped Ag paste against electrochemical corrosion and sulfurization. Anti - Corrosion Methods and Materials. https://doi.org/10.1108/ACMM-08-2024-3064
Cita Chicago Style (17a ed.)
Shih, Huei-Jyun, Ying-Chieh Lee, Jing-Ru Pan, y Claire Chung. "Effects of Sn Addition in W-doped Ag Paste Against Electrochemical Corrosion and Sulfurization." Anti - Corrosion Methods and Materials 2025. https://doi.org/10.1108/ACMM-08-2024-3064.
Cita MLA (9a ed.)
Shih, Huei-Jyun, et al. "Effects of Sn Addition in W-doped Ag Paste Against Electrochemical Corrosion and Sulfurization." Anti - Corrosion Methods and Materials, 2025, https://doi.org/10.1108/ACMM-08-2024-3064.
Precaución: Estas citas no son 100% exactas.