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Effects of Sn addition in W-doped Ag paste against electrochemical corrosion and sulfurization

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Publicado en:Anti - Corrosion Methods and Materials vol. 72, no. 1 (2025), p. 61-70
Autor principal: Shih, Huei-Jyun
Otros Autores: Lee, Ying-Chieh, Jing-Ru Pan, Chung, Claire
Publicado:
Emerald Group Publishing Limited
Materias:
Liquid phases
Investigations
Corrosion prevention
Silver
Sulfur
Corrosion
Electrochemical corrosion
Outdoor air quality
Intermetallic compounds
Corrosion rate
Corrosion resistance
Pastes
Sintering
Corrosion tests
Grain boundaries
Electrochemical analysis
Oxidation
Grain growth
Corrosion effects
Interdiffusion
Cellulose
Grain size
Temperature
Solvents
Corrosion potential
Electronic components
Liquid phase sintering
Electrochemistry
Sulfurization
Morphology
Shear strength
Tin
Environmental
Acceso en línea:Citation/Abstract
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Resumen:PurposeThis study aims to address these challenges by enhancing the resistance of Ag-based pastes to corrosion and sulfurization, thereby improving their performance and weatherability in high-power and high-frequency electronic applications.Design/methodology/approachThis study investigates the influence of Sn doping in W-doped Ag paste to enhance resistance against electrochemical corrosion and sulfurization. A systematic examination was conducted using transient liquid phase sintering and solid–liquid inter-diffusion techniques to understand the microstructural and electrochemical properties.FindingsThis study found that Sn addition in W-doped Ag paste significantly improves its resistance to electrochemical corrosion and sulfurization. The sintering process at 600°C led to the formation of an Ag2WO4 phase at the grain boundaries, which, along with the presence of Sn, effectively inhibited the growth of Ag2WO4 grains. The 0.5% Sn-doped samples exhibited optimal anti-corrosion properties, demonstrating a longer grain boundary length and a passivation effect that significantly reduced the corrosion rate. No Ag2S phase was detected in the weatherability tests, confirming the enhanced durability of the doped samples.Originality/valueThe findings of this study highlight the potential of Sn-doped Ag-W composites as a promising material for electronic components, particularly in environments prone to sulfurization and corrosion. By improving the anti-corrosion properties and reducing the grain size, this study offers a new approach to extending the lifespan and reliability of electronic devices, making a significant contribution to the development of advanced materials for high-power and high-frequency applications.
ISSN:0003-5599
1758-4221
DOI:10.1108/ACMM-08-2024-3064
Fuente:Science Database