Analysis of Edge Termination Techniques for Gallium Nitride Pseudo-Vertical p-n Diodes: Modeling Based on Technology Computer-Aided Design and Review of Current Developments

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Publicado no:Electronics vol. 14, no. 6 (2025), p. 1188
Autor principal: Mohammed El Amrani
Outros Autores: Buckley, Julien, Alquier, Daniel, Godignon, Philippe, Charles, Matthew
Publicado em:
MDPI AG
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024 7 |a 10.3390/electronics14061188  |2 doi 
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100 1 |a Mohammed El Amrani  |u Université Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France; <email>philippe.godignon@cea.fr</email> (P.G.); <email>matthew.charles@cea.fr</email> (M.C.); GREMAN UMR 7347, Université de Tours, CNRS, INSA Centre Val de Loire, 37071 Tours, France; <email>daniel.alquier@univ-tours.fr</email> 
245 1 |a Analysis of Edge Termination Techniques for Gallium Nitride Pseudo-Vertical p-n Diodes: Modeling Based on Technology Computer-Aided Design and Review of Current Developments 
260 |b MDPI AG  |c 2025 
513 |a Journal Article 
520 3 |a Edge termination techniques play a crucial role in enhancing the breakdown voltage (BV) and managing electric field distribution in GaN-based power devices. This review explores six key termination methods—field plate (FP), mesa, bevel, trench, ion implantation, and guard ring (GR)—with a focus on their performance, fabrication complexity, and insights derived from TCAD simulations. FP and trench terminations excel in high-voltage applications due to their superior electric field control but are accompanied by significant fabrication challenges. Mesa and bevel terminations, while simpler and cost-effective, are more suited for medium-voltage applications. Ion implantation and GR techniques strike a balance, offering customizable parameters for improved BV performance. TCAD simulations provide a robust framework for analyzing these techniques, highlighting optimal configurations and performance trade-offs. The choice of edge termination depends on the specific application, balancing BV requirements with manufacturing feasibility. This review offers a comprehensive comparison, emphasizing the critical role of simulations in guiding the selection and design of edge termination techniques for GaN power devices. 
653 |a Simulation 
653 |a Diodes 
653 |a Bevels 
653 |a Electric fields 
653 |a Ion implantation 
653 |a Configuration management 
653 |a Computer aided design--CAD 
653 |a Gallium nitrides 
653 |a Electronic devices 
653 |a Energy consumption 
653 |a Feasibility studies 
700 1 |a Buckley, Julien  |u Université Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France; <email>philippe.godignon@cea.fr</email> (P.G.); <email>matthew.charles@cea.fr</email> (M.C.) 
700 1 |a Alquier, Daniel  |u GREMAN UMR 7347, Université de Tours, CNRS, INSA Centre Val de Loire, 37071 Tours, France; <email>daniel.alquier@univ-tours.fr</email> 
700 1 |a Godignon, Philippe  |u Université Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France; <email>philippe.godignon@cea.fr</email> (P.G.); <email>matthew.charles@cea.fr</email> (M.C.) 
700 1 |a Charles, Matthew  |u Université Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France; <email>philippe.godignon@cea.fr</email> (P.G.); <email>matthew.charles@cea.fr</email> (M.C.) 
773 0 |t Electronics  |g vol. 14, no. 6 (2025), p. 1188 
786 0 |d ProQuest  |t Advanced Technologies & Aerospace Database 
856 4 1 |3 Citation/Abstract  |u https://www.proquest.com/docview/3181456250/abstract/embedded/Q8Z64E4HU3OH5N8U?source=fedsrch 
856 4 0 |3 Full Text + Graphics  |u https://www.proquest.com/docview/3181456250/fulltextwithgraphics/embedded/Q8Z64E4HU3OH5N8U?source=fedsrch 
856 4 0 |3 Full Text - PDF  |u https://www.proquest.com/docview/3181456250/fulltextPDF/embedded/Q8Z64E4HU3OH5N8U?source=fedsrch