A Comprehensive Evaluation of Simulating Thermal Conductivity in Oak Wood Using XCT Imaging

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Detalles Bibliográficos
Publicado en:	Forests vol. 16, no. 5 (2025), p. 834
Autor principal:	Zhao Jingyao
Otros Autores:	Chen, Bonan, Lv Jiajun, Yi Jiancong, Yuan Liying, Liu Yuanchu, Cai Yingchun, Xiang, Chi
Publicado:	MDPI AG
Materias:	Digital imaging Software Accuracy Thermal conductivity Wood Fractal geometry Nuclear magnetic resonance > NMR Thermodynamic properties Thermal properties Fractals Image processing Heat conductivity Conduction Self-similarity Moisture content Simulation Porosity Conductive heat transfer Heat transfer Temperature effects Computed tomography Transient plane source technique Conduction heating Porous materials Pore size Hot pressing Three dimensional imaging Pore size distribution Oak Environmental
Acceso en línea:	Citation/Abstract Full Text + Graphics Full Text - PDF
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