Analysis of Core Temperature Dynamics in Multi-Core Processors
Furkejuvvon:
| Publikašuvnnas: | Journal of Low Power Electronics and Applications vol. 15, no. 4 (2025), p. 68-86 |
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| Váldodahkki: | |
| Eará dahkkit: | |
| Almmustuhtton: |
MDPI AG
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| Fáttát: | |
| Liŋkkat: | Citation/Abstract Full Text + Graphics Full Text - PDF |
| Fáddágilkorat: |
Eai fáddágilkorat, Lasit vuosttaš fáddágilkora!
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MARC
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|---|---|---|---|
| 001 | 3286310030 | ||
| 003 | UK-CbPIL | ||
| 022 | |a 2079-9268 | ||
| 024 | 7 | |a 10.3390/jlpea15040068 |2 doi | |
| 035 | |a 3286310030 | ||
| 045 | 2 | |b d20251001 |b d20251231 | |
| 084 | |a 231478 |2 nlm | ||
| 100 | 1 | |a Ladge Leena |u Department of Information Technology, SIES Graduate School of Technology, University of Mumbai, Navi Mumbai 400706, India | |
| 245 | 1 | |a Analysis of Core Temperature Dynamics in Multi-Core Processors | |
| 260 | |b MDPI AG |c 2025 | ||
| 513 | |a Journal Article | ||
| 520 | 3 | |a As technologies like Artificial Intelligence, Blockchain, Virtual Reality, etc., are advancing, there is a high requirement for High-Performance Computers and multi-core processors to find many applications in today’s Cyber–Physical World. Subsequently, multi-core systems have now become ubiquitous. The core temperature is affected by intensive computational tasks, parallel execution of tasks, thermal coupling effects, and limitations on cooling methods. High temperatures may further decrease the performance of the chip and the overall system. In this paper, we have studied different parameters related to core performance. The MSI Afterburner utility is used to extract the hardware parameters. Single and multivariate analyses are carried out on core temperature, core usage, and core clock to study the performance of all cores. Single-variate analysis shows the need for action when core temperatures, core usage, and clock speeds exceed threshold values. Multivariate analysis reveals correlations between these parameters, guiding optimization strategies. We have also implemented the ARIMA model for core temperature estimation and obtained an average RMSE of 2.44 °C. Our analysis and ARIMA model for temperature estimation are useful in developing smart scheduling algorithms that optimize thermal management and energy efficiency. | |
| 653 | |a Software | ||
| 653 | |a Afterburners | ||
| 653 | |a Trends | ||
| 653 | |a Microprocessors | ||
| 653 | |a Optimization | ||
| 653 | |a Thermal coupling | ||
| 653 | |a Performance evaluation | ||
| 653 | |a Workloads | ||
| 653 | |a Energy consumption | ||
| 653 | |a High temperature | ||
| 653 | |a High performance computing | ||
| 653 | |a Processing speed | ||
| 653 | |a Scheduling | ||
| 653 | |a Machine learning | ||
| 653 | |a Embedded systems | ||
| 653 | |a Virtual reality | ||
| 653 | |a Temperature | ||
| 653 | |a Energy management | ||
| 653 | |a Multivariate analysis | ||
| 653 | |a Energy efficiency | ||
| 653 | |a Processors | ||
| 653 | |a Literature reviews | ||
| 653 | |a Algorithms | ||
| 653 | |a Thermal management | ||
| 653 | |a Artificial intelligence | ||
| 653 | |a Parameters | ||
| 700 | 1 | |a Srinivasa, Rao Y |u Department of Electronics & Telecommunication Engineering, Sardar Patel Institute of Technology, University of Mumbai, Mumbai 400058, India; ysrao@spit.ac.in | |
| 773 | 0 | |t Journal of Low Power Electronics and Applications |g vol. 15, no. 4 (2025), p. 68-86 | |
| 786 | 0 | |d ProQuest |t Advanced Technologies & Aerospace Database | |
| 856 | 4 | 1 | |3 Citation/Abstract |u https://www.proquest.com/docview/3286310030/abstract/embedded/7BTGNMKEMPT1V9Z2?source=fedsrch |
| 856 | 4 | 0 | |3 Full Text + Graphics |u https://www.proquest.com/docview/3286310030/fulltextwithgraphics/embedded/7BTGNMKEMPT1V9Z2?source=fedsrch |
| 856 | 4 | 0 | |3 Full Text - PDF |u https://www.proquest.com/docview/3286310030/fulltextPDF/embedded/7BTGNMKEMPT1V9Z2?source=fedsrch |