The future envelope 3 : facades, the making of /

I tiakina i:
Ngā taipitopito rārangi puna kōrero
Ētahi atu kaituhi: Klein, Tillmann, Knaack, Ulrich
Hōputu: Tāhiko īPukapuka
Reo:Ingarihi
I whakaputaina: Amsterdam : IOS Press, 2010.
Rangatū:Research in architectural engineering series ; v. 10.
Ngā marau:
Urunga tuihono:https://biblioteca.ues.edu.sv/acceso/elibro/?url=https%3A%2F%2Felibro.net%2Fereader%2Fbiblioues/283032
Ver en el OPAC
Ngā Tūtohu: Tāpirihia he Tūtohu
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!