Arteris Bridges Hardware-Software Gap with New EDA Tool

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التفاصيل البيبلوغرافية
الحاوية / القاعدة:	Electronic Design (May 28, 2025)
المؤلف الرئيسي:	Morra, James
منشور في:	Endeavor Business Media
الموضوعات:	Arteris SA Firmware Engineers Computer centers Design specifications Software Designers Semiconductors Upgrading Product development
الوصول للمادة أونلاين:	Citation/Abstract Full Text
الوسوم:	إضافة وسم لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!

الوصف
مستخلص:	By bringing up to 3X faster performance and 5X more capacity for larger chip designs, Arteris explained that it can help engineers quickly develop chips and chiplets ranging from IoT devices to complex AI multi-die SoCs for data centers. According to the company, it allows chip companies to reallocate their engineering resources, saving one to two dedicated engineers per project. According to Arteris, the upgraded the software is able to handle 5X larger chip designs.
تدمد:	0013-4872 1944-9550
المصدر:	Science Database