Arteris Bridges Hardware-Software Gap with New EDA Tool

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發表在:Electronic Design (May 28, 2025)
主要作者: Morra, James
出版:
Endeavor Business Media
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Resumen:By bringing up to 3X faster performance and 5X more capacity for larger chip designs, Arteris explained that it can help engineers quickly develop chips and chiplets ranging from IoT devices to complex AI multi-die SoCs for data centers. According to the company, it allows chip companies to reallocate their engineering resources, saving one to two dedicated engineers per project. According to Arteris, the upgraded the software is able to handle 5X larger chip designs.
ISSN:0013-4872
1944-9550
Fuente:Science Database