Cita APA (7a ed.)
Pan, L., Huang, J., Zhang, J., Hongxiao, G., Wang, J., Daijiang, Z., . . . Jiwei, S. (2025). Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis. Micromachines. https://doi.org/10.3390/mi16111292
Cita Chicago Style (17a ed.)
Pan, Li, Jin Huang, Jie Zhang, Gong Hongxiao, Jianjun Wang, Zuo Daijiang, Su Mengyang, y Shi Jiwei. "Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis." Micromachines 2025. https://doi.org/10.3390/mi16111292.
Cita MLA (9a ed.)
Pan, Li, et al. "Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis." Micromachines, 2025, https://doi.org/10.3390/mi16111292.
Precaución: Estas citas no son 100% exactas.