APA-Zitierstil (7. Ausg.)
Pan, L., Huang, J., Zhang, J., Hongxiao, G., Wang, J., Daijiang, Z., . . . Jiwei, S. (2025). Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis. Micromachines. https://doi.org/10.3390/mi16111292
Chicago-Zitierstil (17. Ausg.)
Pan, Li, Jin Huang, Jie Zhang, Gong Hongxiao, Jianjun Wang, Zuo Daijiang, Su Mengyang, und Shi Jiwei. "Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis." Micromachines 2025. https://doi.org/10.3390/mi16111292.
MLA-Zitierstil (9. Ausg.)
Pan, Li, et al. "Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis." Micromachines, 2025, https://doi.org/10.3390/mi16111292.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.