Citace podle APA (7th ed.)
Pan, L., Huang, J., Zhang, J., Hongxiao, G., Wang, J., Daijiang, Z., . . . Jiwei, S. (2025). Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis. Micromachines. https://doi.org/10.3390/mi16111292
Citace podle Chicago (17th ed.)
Pan, Li, Jin Huang, Jie Zhang, Gong Hongxiao, Jianjun Wang, Zuo Daijiang, Su Mengyang, a Shi Jiwei. "Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis." Micromachines 2025. https://doi.org/10.3390/mi16111292.
Citace podle MLA (9th ed.)
Pan, Li, et al. "Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis." Micromachines, 2025, https://doi.org/10.3390/mi16111292.
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