Interfacial Structure and Bonding Properties of Ag/Cu Through-Layered Composite Fabricated by Dual-Face Hot-Roll Inlaying Process

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Detalles Bibliográficos
Publicado en:	Materials vol. 18, no. 24 (2025), p. 5580-5597
Autor principal:	Wang, Yong
Otros Autores:	Yang, Quanzhen, Guo Kunshan, Liu Tianhao, Zhao, Xue, Huang, Lei, Ruan Haiguang, Zhou, Xiaorong, Chen, Yi
Publicado:	MDPI AG
Materias:	Crystal structure Cold Tensile properties Multilayers Electron probe microanalysis Electrical installations Bonding strength Silver Copper Crystallography Electrical resistivity Intermetallic compounds Laminates Composite materials Annealing Electron diffraction Continuous casting Oxidation Interdiffusion Temperature Field emission microscopy Hot rolling Electric fuses Tensile strength Brasses Friction welding Interfaces
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Descripción
Resumen:	<sec sec-type="highlights"> What are the main findings? <list list-type="bullet"> <list-item> A novel dual-face hot-roll inlaying process was developed to fabricate a Ag/Cu through-layered composite. The Ag and Cu layers had the same textural components (copper, brass, and S-type components). However, no well-matched crystallographic orientation relationship was identified at the Ag/Cu interface. </list-item> <list-item> The width of the elemental interdiffusion layer is generally less than 2 μm. The Ag/Cu interface bonding strength surpasses the tensile strength of Ag (260 MPa), and each interface contributes an increase of 1.1% to the electrical resistivity of the composite. </list-item> What is the implication of the main finding? <list list-type="bullet"> <list-item> This Ag/Cu through-layered composite is a promising candidate for use as a substitute for pure Ag in the fabrication of melt elements in fuses, and it is commercially available. </list-item> A novel dual-face hot-roll inlaying technique was developed to fabricate a Ag/Cu through-layered composite for use in melt elements for fuse production, including two stages of grooving in a Cu strip followed by separate inlaying of Ag strips at the same positions on the opposite surfaces. The microstructure was characterized using field emission scanning electron microscopy (FE-SEM), electron probe microanalysis (EPMA), X-ray diffraction (XRD), and selective area electron diffraction (SAED). The Ag/Cu interfaces are flat and well bonded, with an elemental interdiffusion layer of less than 2 μm. The same textural components—copper, brass, and S-type components—were identified in both the Ag and Cu layers. However, no well-matched crystal orientation relationship between Ag and Cu was detected at the interface. Moreover, tensile properties and electrical resistance were measured to evaluate the bonding strength and conductivity of the interface. It was found that Ag/Cu bonding strength surpassed the tensile strength of Ag, i.e., 260 MPa. While the total elongation is less than 1%, the Ag layer exhibits excellent plasticity, with a section shrinkage over 90%. Compared with the calculated resistivity with a series circuit model, the tested value of the composite sample, including six Ag/Cu interfaces, increased by only 6.6%, indicating good conductivity of the Ag/Cu interface. Therefore, the obtained composite is a promising candidate for the fabrication of melt elements.
ISSN:	1996-1944
DOI:	10.3390/ma18245580
Fuente:	Materials Science Database