Interfacial Structure and Bonding Properties of Ag/Cu Through-Layered Composite Fabricated by Dual-Face Hot-Roll Inlaying Process

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Detalles Bibliográficos
Publicado en:	Materials vol. 18, no. 24 (2025), p. 5580-5597
Autor principal:	Wang, Yong
Otros Autores:	Yang, Quanzhen, Guo Kunshan, Liu Tianhao, Zhao, Xue, Huang, Lei, Ruan Haiguang, Zhou, Xiaorong, Chen, Yi
Publicado:	MDPI AG
Materias:	Crystal structure Cold Tensile properties Multilayers Electron probe microanalysis Electrical installations Bonding strength Silver Copper Crystallography Electrical resistivity Intermetallic compounds Laminates Composite materials Annealing Electron diffraction Continuous casting Oxidation Interdiffusion Temperature Field emission microscopy Hot rolling Electric fuses Tensile strength Brasses Friction welding Interfaces
Acceso en línea:	Citation/Abstract Full Text + Graphics Full Text - PDF
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