Effects of Sn addition in W-doped Ag paste against electrochemical corrosion and sulfurization

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Detalles Bibliográficos
Publicado en:	Anti - Corrosion Methods and Materials vol. 72, no. 1 (2025), p. 61-70
Autor principal:	Shih, Huei-Jyun
Otros Autores:	Lee, Ying-Chieh, Jing-Ru Pan, Chung, Claire
Publicado:	Emerald Group Publishing Limited
Materias:	Liquid phases Investigations Corrosion prevention Silver Sulfur Corrosion Electrochemical corrosion Outdoor air quality Intermetallic compounds Corrosion rate Corrosion resistance Pastes Sintering Corrosion tests Grain boundaries Electrochemical analysis Oxidation Grain growth Corrosion effects Interdiffusion Cellulose Grain size Temperature Solvents Corrosion potential Electronic components Liquid phase sintering Electrochemistry Sulfurization Morphology Shear strength Tin Environmental
Acceso en línea:	Citation/Abstract Full Text Full Text - PDF
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