Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages

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Detalles Bibliográficos
Publicado en:	Soldering & Surface Mount Technology vol. 37, no. 1 (2025), p. 1-16
Autor principal:	Muhammad Aqil Azman
Otros Autores:	Mz Abdullah, Loh, Wei Keat, Ooi, Chun Keang
Publicado:	Emerald Group Publishing Limited
Materias:	Behavior Package design Configuration management Investigations Fluid dynamics Fluid flow Parameter robustness Three dimensional flow Boundary conditions Contact angle Incompressible flow Electronic packaging Simulation Viscosity Artificial intelligence Solders Capillary flow Newtonian fluids Mathematical models Flow characteristics Computer aided design > CAD Computational fluid dynamics Computer aided engineering > CAE Thickness Weight Non Newtonian fluids
Acceso en línea:	Citation/Abstract Full Text Full Text - PDF
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