Buchumschlag

CMOS-Compatible Ultrasonic 3D Beamforming Sensor System for Automotive Applications

Gespeichert in:
Veröffentlicht in:Applied Sciences vol. 15, no. 16 (2025), p. 9201-9218
1. Verfasser: Hussain Khurshid
Weitere Verfasser: Jeon Wanhae, Lee, Yongmin, Song In-Hyouk, Oh Inn-Yeal
Veröffentlicht:
MDPI AG
Schlagworte:
United States > US
Design
Technological change
Arrays
Acoustics
Ultrasonic transducers
Bandwidths
Ultrasonic imaging
Technology
Signal processing
Sensors
Online-Zugang:Citation/Abstract
Full Text + Graphics
Full Text - PDF
Tags: Tag hinzufügen
Keine Tags, Fügen Sie das erste Tag hinzu!
Abstract:This paper presents a fully electronic, CMOS-compatible ultrasonic sensing system integrated into a 3D beamforming architecture for advanced automotive applications. The proposed system eliminates mechanical scanning by implementing a dual-path beamforming structure comprising programmable transmit (TX) and receive (RX) paths. The TX beamformer introduces per-element time delays derived from steering angles to control the direction of ultrasonic wave propagation, while the RX beamformer aligns echo signals for spatial focusing. Electrostatic actuation governs the CMOS-compatible ultrasonic transmission mechanism, whereas dynamic modulation under acoustic pressure forms the reception mechanism. The system architecture supports full horizontal and vertical angular coverage, leveraging delay-and-sum processing to achieve electronically steerable beams. The system enables low-power, compact, and high-resolution sensing modules by integrating signal generation, beam control, and delay logic within a CMOS framework. Theoretical modeling demonstrates its capability to support fine spatial resolution and fast response, making it suitable for integration into autonomous vehicle platforms and driver-assistance systems.
ISSN:2076-3417
DOI:10.3390/app15169201
Quelle:Publicly Available Content Database