CMOS-Compatible Ultrasonic 3D Beamforming Sensor System for Automotive Applications

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Publicat a:Applied Sciences vol. 15, no. 16 (2025), p. 9201-9218
Autor principal: Hussain Khurshid
Altres autors: Jeon Wanhae, Lee, Yongmin, Song In-Hyouk, Oh Inn-Yeal
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MDPI AG
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022 |a 2076-3417 
024 7 |a 10.3390/app15169201  |2 doi 
035 |a 3243981521 
045 2 |b d20250101  |b d20251231 
084 |a 231338  |2 nlm 
100 1 |a Hussain Khurshid  |u Department of Mobility Semiconductor Engineering, Sun Moon University, Asan 31460, Republic of Korea; khurshid12@sunmoon.ac.kr (K.H.); jeonwahae@sunmoon.ac.kr (W.J.) 
245 1 |a CMOS-Compatible Ultrasonic 3D Beamforming Sensor System for Automotive Applications 
260 |b MDPI AG  |c 2025 
513 |a Review 
520 3 |a This paper presents a fully electronic, CMOS-compatible ultrasonic sensing system integrated into a 3D beamforming architecture for advanced automotive applications. The proposed system eliminates mechanical scanning by implementing a dual-path beamforming structure comprising programmable transmit (TX) and receive (RX) paths. The TX beamformer introduces per-element time delays derived from steering angles to control the direction of ultrasonic wave propagation, while the RX beamformer aligns echo signals for spatial focusing. Electrostatic actuation governs the CMOS-compatible ultrasonic transmission mechanism, whereas dynamic modulation under acoustic pressure forms the reception mechanism. The system architecture supports full horizontal and vertical angular coverage, leveraging delay-and-sum processing to achieve electronically steerable beams. The system enables low-power, compact, and high-resolution sensing modules by integrating signal generation, beam control, and delay logic within a CMOS framework. Theoretical modeling demonstrates its capability to support fine spatial resolution and fast response, making it suitable for integration into autonomous vehicle platforms and driver-assistance systems. 
651 4 |a United States--US 
653 |a Design 
653 |a Technological change 
653 |a Arrays 
653 |a Acoustics 
653 |a Ultrasonic transducers 
653 |a Bandwidths 
653 |a Ultrasonic imaging 
653 |a Technology 
653 |a Signal processing 
653 |a Sensors 
700 1 |a Jeon Wanhae  |u Department of Mobility Semiconductor Engineering, Sun Moon University, Asan 31460, Republic of Korea; khurshid12@sunmoon.ac.kr (K.H.); jeonwahae@sunmoon.ac.kr (W.J.) 
700 1 |a Lee, Yongmin  |u Department of Display & Semiconductor Engineering, Sun Moon University, Asan 31460, Republic of Korea 
700 1 |a Song In-Hyouk  |u Department of Engineering Technology, Texas State University, San Marcos, TX 78666, USA; in-hyouk.song@txstate.edu 
700 1 |a Oh Inn-Yeal  |u Department of Mobility Semiconductor Engineering, Sun Moon University, Asan 31460, Republic of Korea; khurshid12@sunmoon.ac.kr (K.H.); jeonwahae@sunmoon.ac.kr (W.J.) 
773 0 |t Applied Sciences  |g vol. 15, no. 16 (2025), p. 9201-9218 
786 0 |d ProQuest  |t Publicly Available Content Database 
856 4 1 |3 Citation/Abstract  |u https://www.proquest.com/docview/3243981521/abstract/embedded/160PP4OP4BJVV2EV?source=fedsrch 
856 4 0 |3 Full Text + Graphics  |u https://www.proquest.com/docview/3243981521/fulltextwithgraphics/embedded/160PP4OP4BJVV2EV?source=fedsrch 
856 4 0 |3 Full Text - PDF  |u https://www.proquest.com/docview/3243981521/fulltextPDF/embedded/160PP4OP4BJVV2EV?source=fedsrch