CMOS-Compatible Ultrasonic 3D Beamforming Sensor System for Automotive Applications
保存先:
| 出版年: | Applied Sciences vol. 15, no. 16 (2025), p. 9201-9218 |
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| 第一著者: | |
| その他の著者: | , , , |
| 出版事項: |
MDPI AG
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| 主題: | |
| オンライン･アクセス: | Citation/Abstract Full Text + Graphics Full Text - PDF |
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| 抄録: | This paper presents a fully electronic, CMOS-compatible ultrasonic sensing system integrated into a 3D beamforming architecture for advanced automotive applications. The proposed system eliminates mechanical scanning by implementing a dual-path beamforming structure comprising programmable transmit (TX) and receive (RX) paths. The TX beamformer introduces per-element time delays derived from steering angles to control the direction of ultrasonic wave propagation, while the RX beamformer aligns echo signals for spatial focusing. Electrostatic actuation governs the CMOS-compatible ultrasonic transmission mechanism, whereas dynamic modulation under acoustic pressure forms the reception mechanism. The system architecture supports full horizontal and vertical angular coverage, leveraging delay-and-sum processing to achieve electronically steerable beams. The system enables low-power, compact, and high-resolution sensing modules by integrating signal generation, beam control, and delay logic within a CMOS framework. Theoretical modeling demonstrates its capability to support fine spatial resolution and fast response, making it suitable for integration into autonomous vehicle platforms and driver-assistance systems. |
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| ISSN: | 2076-3417 |
| DOI: | 10.3390/app15169201 |
| ソース: | Publicly Available Content Database |