Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis
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| Publicado en: | Micromachines vol. 16, no. 11 (2025), p. 1292-1321 |
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| Otros Autores: | , , , , , , |
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MDPI AG
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| Acceso en línea: | Citation/Abstract Full Text + Graphics Full Text - PDF |
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| LEADER | 00000nab a2200000uu 4500 | ||
|---|---|---|---|
| 001 | 3275543732 | ||
| 003 | UK-CbPIL | ||
| 022 | |a 2072-666X | ||
| 024 | 7 | |a 10.3390/mi16111292 |2 doi | |
| 035 | |a 3275543732 | ||
| 045 | 2 | |b d20250101 |b d20251231 | |
| 084 | |a 231537 |2 nlm | ||
| 100 | 1 | |a Pan, Li |u State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi’an 710071, China; 23041212614@stu.xidian.edu.cn (P.L.); hxgong@xidian.edu.cn (H.G.); wangjianjun@xidian.edu.cn (J.W.); 23041212718@stu.xidian.edu.cn (D.Z.); 23041212582@stu.xidian.edu.cn (M.S.) | |
| 245 | 1 | |a Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis | |
| 260 | |b MDPI AG |c 2025 | ||
| 513 | |a Journal Article | ||
| 520 | 3 | |a Ruggedized computers are the core of modern communication, guidance, control, and data-processing systems, and typically operate under extreme environmental conditions. However, under extreme service conditions such as temperature cycling, vibration, and mechanical shock, thermo–electro–mechanical (TME) multi-physics coupling in ball grid array (BGA) solder joints is particularly significant, severely affecting system reliability and signal integrity. To comprehensively elucidate the effects of thermal, electrical, and mechanical fields on solder joints and signal transmission, this study proposes a multiscale multi-physics modeling and analysis framework for BGA solder joints in microelectronic systems of ruggedized computers, covering the computer system level, motherboard level, solder joint level, and solder interconnect level. A model correlation study under ten thermal cycling conditions demonstrated an accuracy of 88.89%, confirming the validity and applicability of the proposed model. Based on this validated framework and model, the temperature distribution, stress–strain response, and signal integrity characteristics were further analyzed under combined conditions of thermal cycling, random vibration, and mechanical shock. The results indicate that a rise in temperature in solder joints induces thermal stresses and deformations, while variations in electrical conductivity under thermal loading trigger electromigration and concentration evolution, which further couple with stress gradients to form TME multi-physics interactions. Under such coupling, critical solder balls exhibit stress concentration at the metallurgical interfaces, with a maximum von Mises stress of 191.51 MPa accompanied by plastic strain accumulation. In addition, the PCIe high-speed interconnect experienced a maximum deformation of 16.104 μm and a voltage amplitude reduction of approximately 18.51% after 928 thermal cycles, exceeding the normal operating range. This research provides a theoretical basis and engineering reference for reliability assessment and optimization design of microelectronic systems in ruggedized computers in complex service environments. | |
| 653 | |a Reliability analysis | ||
| 653 | |a Temperature distribution | ||
| 653 | |a Mechanical shock | ||
| 653 | |a Plastic deformation | ||
| 653 | |a Accuracy | ||
| 653 | |a Thermal cycling | ||
| 653 | |a Data processing | ||
| 653 | |a System reliability | ||
| 653 | |a Investigations | ||
| 653 | |a Stress concentration | ||
| 653 | |a Mathematical models | ||
| 653 | |a Modelling | ||
| 653 | |a Crack initiation | ||
| 653 | |a Electrical resistivity | ||
| 653 | |a Random vibration | ||
| 653 | |a Joining | ||
| 653 | |a Coupling | ||
| 653 | |a Ball grid packaging | ||
| 653 | |a Signal transmission | ||
| 653 | |a Computers | ||
| 653 | |a Physics | ||
| 653 | |a Solders | ||
| 653 | |a Signal integrity | ||
| 653 | |a Electric fields | ||
| 653 | |a Concentration gradient | ||
| 653 | |a Thermal stress | ||
| 653 | |a Motherboards | ||
| 653 | |a Finite element analysis | ||
| 653 | |a Electromigration | ||
| 653 | |a Lead | ||
| 653 | |a Design optimization | ||
| 653 | |a Microelectronics | ||
| 653 | |a Strain | ||
| 653 | |a Soldered joints | ||
| 653 | |a Shear strength | ||
| 700 | 1 | |a Huang, Jin |u State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi’an 710071, China; 23041212614@stu.xidian.edu.cn (P.L.); hxgong@xidian.edu.cn (H.G.); wangjianjun@xidian.edu.cn (J.W.); 23041212718@stu.xidian.edu.cn (D.Z.); 23041212582@stu.xidian.edu.cn (M.S.) | |
| 700 | 1 | |a Zhang, Jie |u State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi’an 710071, China; 23041212614@stu.xidian.edu.cn (P.L.); hxgong@xidian.edu.cn (H.G.); wangjianjun@xidian.edu.cn (J.W.); 23041212718@stu.xidian.edu.cn (D.Z.); 23041212582@stu.xidian.edu.cn (M.S.) | |
| 700 | 1 | |a Gong Hongxiao |u State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi’an 710071, China; 23041212614@stu.xidian.edu.cn (P.L.); hxgong@xidian.edu.cn (H.G.); wangjianjun@xidian.edu.cn (J.W.); 23041212718@stu.xidian.edu.cn (D.Z.); 23041212582@stu.xidian.edu.cn (M.S.) | |
| 700 | 1 | |a Wang, Jianjun |u State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi’an 710071, China; 23041212614@stu.xidian.edu.cn (P.L.); hxgong@xidian.edu.cn (H.G.); wangjianjun@xidian.edu.cn (J.W.); 23041212718@stu.xidian.edu.cn (D.Z.); 23041212582@stu.xidian.edu.cn (M.S.) | |
| 700 | 1 | |a Zuo Daijiang |u State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi’an 710071, China; 23041212614@stu.xidian.edu.cn (P.L.); hxgong@xidian.edu.cn (H.G.); wangjianjun@xidian.edu.cn (J.W.); 23041212718@stu.xidian.edu.cn (D.Z.); 23041212582@stu.xidian.edu.cn (M.S.) | |
| 700 | 1 | |a Su Mengyang |u State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi’an 710071, China; 23041212614@stu.xidian.edu.cn (P.L.); hxgong@xidian.edu.cn (H.G.); wangjianjun@xidian.edu.cn (J.W.); 23041212718@stu.xidian.edu.cn (D.Z.); 23041212582@stu.xidian.edu.cn (M.S.) | |
| 700 | 1 | |a Shi Jiwei |u Zhongxing Telecommunication Equipment Corporation, Xi’an 710076, China; jiweishi2021@163.com | |
| 773 | 0 | |t Micromachines |g vol. 16, no. 11 (2025), p. 1292-1321 | |
| 786 | 0 | |d ProQuest |t Engineering Database | |
| 856 | 4 | 1 | |3 Citation/Abstract |u https://www.proquest.com/docview/3275543732/abstract/embedded/L8HZQI7Z43R0LA5T?source=fedsrch |
| 856 | 4 | 0 | |3 Full Text + Graphics |u https://www.proquest.com/docview/3275543732/fulltextwithgraphics/embedded/L8HZQI7Z43R0LA5T?source=fedsrch |
| 856 | 4 | 0 | |3 Full Text - PDF |u https://www.proquest.com/docview/3275543732/fulltextPDF/embedded/L8HZQI7Z43R0LA5T?source=fedsrch |