Interfacial Structure and Bonding Properties of Ag/Cu Through-Layered Composite Fabricated by Dual-Face Hot-Roll Inlaying Process

में बचाया:

ग्रंथसूची विवरण
में प्रकाशित:	Materials vol. 18, no. 24 (2025), p. 5580-5597
मुख्य लेखक:	Wang, Yong
अन्य लेखक:	Yang, Quanzhen, Guo Kunshan, Liu Tianhao, Zhao, Xue, Huang, Lei, Ruan Haiguang, Zhou, Xiaorong, Chen, Yi
प्रकाशित:	MDPI AG
विषय:	Crystal structure Cold Tensile properties Multilayers Electron probe microanalysis Electrical installations Bonding strength Silver Copper Crystallography Electrical resistivity Intermetallic compounds Laminates Composite materials Annealing Electron diffraction Continuous casting Oxidation Interdiffusion Temperature Field emission microscopy Hot rolling Electric fuses Tensile strength Brasses Friction welding Interfaces
ऑनलाइन पहुंच:	Citation/Abstract Full Text + Graphics Full Text - PDF
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