Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging

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Bibliographic Details
Published in:	Micromachines vol. 16, no. 3 (2025), p. 342
Main Author:	Ching-Feng, Yu
Other Authors:	Jr-Wei, Peng, Chih-Cheng, Hsiao, Chin-Hung, Wang, Wei-Chung, Lo
Published:	MDPI AG
Subjects:	Silicon User interface Machine learning Simulation Warpage Research methodology Deep learning Semiconductors Fanout Neural networks Engineers Copper Energy efficiency Graphical user interface Integrated approach Error reduction Algorithms Manufacturing Artificial intelligence Transistors Packaging Curing Electronic packaging
Online Access:	Citation/Abstract Full Text + Graphics Full Text - PDF
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