Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging

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Detalles Bibliográficos
Publicado en:	Micromachines vol. 16, no. 3 (2025), p. 342
Autor principal:	Ching-Feng, Yu
Otros Autores:	Jr-Wei, Peng, Chih-Cheng, Hsiao, Chin-Hung, Wang, Wei-Chung, Lo
Publicado:	MDPI AG
Materias:	Silicon User interface Machine learning Simulation Warpage Research methodology Deep learning Semiconductors Fanout Neural networks Engineers Copper Energy efficiency Graphical user interface Integrated approach Error reduction Algorithms Manufacturing Artificial intelligence Transistors Packaging Curing Electronic packaging
Acceso en línea:	Citation/Abstract Full Text + Graphics Full Text - PDF
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