Molecularly tailored SAMs for Ru interconnects: high-temperature stability, suppressed metal diffusion, and enhanced adhesion

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Detalles Bibliográficos
Publicado en:	NPG Asia Materials vol. 17, no. 1 (2025), p. 45-63
Autor principal:	Wu, Hong-Yi
Otros Autores:	Fang, Yi-Ying, Chen, Yu-Lin, Lu, Jung-Fu, Lu, Ming-Yen, Chang, Shou-Yi, Keng, Pei Yuin
Publicado:	Nature Publishing Group
Materias:	United States > US Germany Interconnections Electrons Thermal stability Performance evaluation Electrical resistance Molecular structure Diffusion barriers Transmission electron microscopy Copper Metallizing Semiconductor devices Thin films Silicides Ethanol Silicon Scanning transmission electron microscopy Linings Integrated circuits Substrates Interdiffusion Electronic components Self-assembly Adhesion Silicon wafers Diffusion rate Annealing Wiring Artificial intelligence Monolayers
Acceso en línea:	Citation/Abstract Full Text Full Text - PDF
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