Molecularly tailored SAMs for Ru interconnects: high-temperature stability, suppressed metal diffusion, and enhanced adhesion

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Bibliografiset tiedot
Julkaisussa:	NPG Asia Materials vol. 17, no. 1 (2025), p. 45-63
Päätekijä:	Wu, Hong-Yi
Muut tekijät:	Fang, Yi-Ying, Chen, Yu-Lin, Lu, Jung-Fu, Lu, Ming-Yen, Chang, Shou-Yi, Keng, Pei Yuin
Julkaistu:	Nature Publishing Group
Aiheet:	United States > US Germany Interconnections Electrons Performance evaluation Thermal stability Molecular structure Electrical resistance Diffusion barriers Transmission electron microscopy Copper Metallizing Thin films Semiconductor devices Silicides Ethanol Silicon Scanning transmission electron microscopy Linings Integrated circuits Substrates Interdiffusion Self-assembly Electronic components Adhesion Silicon wafers Annealing Diffusion rate Wiring Artificial intelligence Monolayers
Linkit:	Citation/Abstract Full Text Full Text - PDF
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