Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
保存先:
| 第一著者: | |
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| その他の著者: | |
| フォーマット: | 電子媒体 eBook |
| 言語: | 英語 |
| 出版事項: |
Hoboken, N.J. :
Wiley,
2011.
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| 主題: | |
| オンライン･アクセス: | https://biblioteca.ues.edu.sv/acceso/elibro/?url=https%3A%2F%2Felibro.net%2Fereader%2Fbiblioues/180022 OPACで表示 |
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| 要約: | "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |
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| 物理的記述: | xxii, 564 p. : ill. |
| 書誌: | Includes bibliographical references and index. |
| ISBN: | 9780470827819 |