Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability and testing /
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Tallennettuna:
| Päätekijä: | |
|---|---|
| Muut tekijät: | |
| Aineistotyyppi: | Elektroninen E-kirja |
| Kieli: | englanti |
| Julkaistu: |
Hoboken, N.J. :
Wiley,
2011.
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| Aiheet: | |
| Linkit: | https://biblioteca.ues.edu.sv/acceso/elibro/?url=https%3A%2F%2Felibro.net%2Fereader%2Fbiblioues/180022 Näytä asiakasliittymässä |
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| 003 | FINmELB | ||
| 005 | 20250820144314.0 | ||
| 006 | m o d | | ||
| 007 | cr cn||||||||| | ||
| 008 | 250820s2011 njuad sb 001 0 eng d | ||
| 010 | |z 2011019534 | ||
| 020 | |a 9780470827819 |q (ebook) | ||
| 035 | |a (OCoLC)699765387 | ||
| 040 | |a FINmELB |b eng |e rda |c FINmELB | ||
| 050 | 4 | |a TK7870.15 |b .L58 2011 | |
| 082 | 0 | 4 | |a 621.381/046 |2 23 |
| 100 | 1 | |a Liu, S. |q (Sheng), |d 1963- | |
| 245 | 1 | 0 | |a Modeling and simulation for microelectronic packaging assembly : |b manufacturing, reliability and testing / |c Sheng Liu, Yong Liu. |
| 264 | 1 | |a Hoboken, N.J. : |b Wiley, |c 2011. | |
| 300 | |a xxii, 564 p. : |b ill. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a data file |2 rda | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging. | |
| 520 | |a "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |c Provided by publisher. | ||
| 588 | |a Description based on metadata supplied by the publisher and other sources. | ||
| 590 | |a Electronic resource. Santa Fe, Argentina: elibro, 2025. Available via the World Wide Web. Access may be limited to libraries affiliated with elibro. | ||
| 650 | 0 | |a Microelectronic packaging |x Simulation methods. | |
| 655 | 4 | |a Electronic books. | |
| 700 | 1 | |a Liu, Yong, |d 1962- | |
| 797 | 2 | |a elibro, Corp. | |
| 856 | 4 | 0 | |u https://biblioteca.ues.edu.sv/acceso/elibro/?url=https%3A%2F%2Felibro.net%2Fereader%2Fbiblioues/180022 |