Modeling and Simulation for Microelectronic Packaging Assembly

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Bibliografiske detaljer
Hovedforfatter:	Liu, Shen
Andre forfattere:	Liu, Yong
Udgivet:	John Wiley & Sons, Incorporated
Fag:	Package design Design of experiments Microelectronic packaging > Simulation methods. Design engineering Circuits Manufacturing Electronics Co-design Packaging Technology Engineers Simulation Marketing Industrial design TJF Microelectronic packaging > Simulation methods Engineering Concurrent engineering Product development TGP Scholarships & fellowships
Online adgang:	Full Text - Ebook
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