Modeling and Simulation for Microelectronic Packaging Assembly

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Detaylı Bibliyografya
Yazar:	Liu, Shen
Diğer Yazarlar:	Liu, Yong
Baskı/Yayın Bilgisi:	John Wiley & Sons, Incorporated
Konular:	Package design Design of experiments Microelectronic packaging > Simulation methods. Design engineering Circuits Manufacturing Electronics Co-design Packaging Technology Engineers Simulation Marketing Industrial design TJF Microelectronic packaging > Simulation methods Engineering Concurrent engineering Product development TGP Scholarships & fellowships
Online Erişim:	Full Text - Ebook
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