Modeling and Simulation for Microelectronic Packaging Assembly

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Dettagli Bibliografici
Autore principale:	Liu, Shen
Altri autori:	Liu, Yong
Pubblicazione:	John Wiley & Sons, Incorporated
Soggetti:	Package design Design of experiments Microelectronic packaging > Simulation methods. Design engineering Circuits Manufacturing Electronics Co-design Packaging Technology Engineers Simulation Marketing Industrial design TJF Microelectronic packaging > Simulation methods Engineering Concurrent engineering Product development TGP Scholarships & fellowships
Accesso online:	Full Text - Ebook
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