Modeling and Simulation for Microelectronic Packaging Assembly

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Bibliographic Details
Main Author:	Liu, Shen
Other Authors:	Liu, Yong
Published:	John Wiley & Sons, Incorporated
Subjects:	Package design Design of experiments Microelectronic packaging > Simulation methods. Design engineering Circuits Manufacturing Electronics Co-design Packaging Technology Engineers Simulation Marketing Industrial design TJF Microelectronic packaging > Simulation methods Engineering Concurrent engineering Product development TGP Scholarships & fellowships
Online Access:	Full Text - Ebook
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