Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis

Guardado en:

Bibliografiske detaljer
Udgivet i:	Micromachines vol. 16, no. 11 (2025), p. 1292-1321
Hovedforfatter:	Pan, Li
Andre forfattere:	Huang, Jin, Zhang, Jie, Gong Hongxiao, Wang, Jianjun, Zuo Daijiang, Su Mengyang, Shi Jiwei
Udgivet:	MDPI AG
Fag:	Reliability analysis Temperature distribution Mechanical shock Plastic deformation Accuracy Thermal cycling Data processing System reliability Investigations Stress concentration Mathematical models Modelling Crack initiation Electrical resistivity Random vibration Joining Coupling Ball grid packaging Signal transmission Computers Physics Solders Signal integrity Electric fields Concentration gradient Thermal stress Motherboards Finite element analysis Electromigration Lead Design optimization Microelectronics Strain Soldered joints Shear strength
Online adgang:	Citation/Abstract Full Text + Graphics Full Text - PDF
Tags:	Tilføj Tag Ingen Tags, Vær først til at tagge denne postø!

Vær først til at give en kommentarø!