Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis

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Publié dans:	Micromachines vol. 16, no. 11 (2025), p. 1292-1321
Auteur principal:	Pan, Li
Autres auteurs:	Huang, Jin, Zhang, Jie, Gong Hongxiao, Wang, Jianjun, Zuo Daijiang, Su Mengyang, Shi Jiwei
Publié:	MDPI AG
Sujets:	Reliability analysis Temperature distribution Mechanical shock Plastic deformation Accuracy Thermal cycling Data processing System reliability Investigations Stress concentration Mathematical models Modelling Crack initiation Electrical resistivity Random vibration Joining Coupling Ball grid packaging Signal transmission Computers Physics Solders Signal integrity Electric fields Concentration gradient Thermal stress Motherboards Finite element analysis Electromigration Lead Design optimization Microelectronics Strain Soldered joints Shear strength
Accès en ligne:	Citation/Abstract Full Text + Graphics Full Text - PDF
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