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Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis

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Pubblicato in:Micromachines vol. 16, no. 11 (2025), p. 1292-1321
Autore principale: Pan, Li
Altri autori: Huang, Jin, Zhang, Jie, Gong Hongxiao, Wang, Jianjun, Zuo Daijiang, Su Mengyang, Shi Jiwei
Pubblicazione:
MDPI AG
Soggetti:
Reliability analysis
Temperature distribution
Mechanical shock
Plastic deformation
Accuracy
Thermal cycling
Data processing
System reliability
Investigations
Stress concentration
Mathematical models
Modelling
Crack initiation
Electrical resistivity
Random vibration
Joining
Coupling
Ball grid packaging
Signal transmission
Computers
Physics
Solders
Signal integrity
Electric fields
Concentration gradient
Thermal stress
Motherboards
Finite element analysis
Electromigration
Lead
Design optimization
Microelectronics
Strain
Soldered joints
Shear strength
Accesso online:Citation/Abstract
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