Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis

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書目詳細資料
發表在:	Micromachines vol. 16, no. 11 (2025), p. 1292-1321
主要作者:	Pan, Li
其他作者:	Huang, Jin, Zhang, Jie, Gong Hongxiao, Wang, Jianjun, Zuo Daijiang, Su Mengyang, Shi Jiwei
出版:	MDPI AG
主題:	Reliability analysis Temperature distribution Mechanical shock Plastic deformation Accuracy Thermal cycling Data processing System reliability Investigations Stress concentration Mathematical models Modelling Crack initiation Electrical resistivity Random vibration Joining Coupling Ball grid packaging Signal transmission Computers Physics Solders Signal integrity Electric fields Concentration gradient Thermal stress Motherboards Finite element analysis Electromigration Lead Design optimization Microelectronics Strain Soldered joints Shear strength
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