Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis

Kaydedildi:

Detaylı Bibliyografya
Yayımlandı:	Micromachines vol. 16, no. 11 (2025), p. 1292-1321
Yazar:	Pan, Li
Diğer Yazarlar:	Huang, Jin, Zhang, Jie, Gong Hongxiao, Wang, Jianjun, Zuo Daijiang, Su Mengyang, Shi Jiwei
Baskı/Yayın Bilgisi:	MDPI AG
Konular:	Reliability analysis Temperature distribution Mechanical shock Plastic deformation Accuracy Thermal cycling Data processing System reliability Investigations Stress concentration Mathematical models Modelling Crack initiation Electrical resistivity Random vibration Joining Coupling Ball grid packaging Signal transmission Computers Physics Solders Signal integrity Electric fields Concentration gradient Thermal stress Motherboards Finite element analysis Electromigration Lead Design optimization Microelectronics Strain Soldered joints Shear strength
Online Erişim:	Citation/Abstract Full Text + Graphics Full Text - PDF
Etiketler:	Etiketle Etiket eklenmemiş, İlk siz ekleyin!

İlk yorumlayan siz olun!